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Personal data sheet |
Print preview personal data approved: 2023. X. 02. Publications |
2023
from data base, 2023. X. 02. |
Bognár Gy., Takács G., Szabó P. G.: A novel approach for cooling chiplets in heterogeneously integrated 2.5D packages applying microchannel heatsink embedded in the interposer, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 13: (8) pp. 1155-1163. type of document: Journal paper/Article language: English URL |
2022
from data base, 2023. X. 02. |
Bognar Gyorgy, Takacs Gabor, Szabo Peter G.: Thermal modelling of embedded microscale channel structures realized in heterogeneous packaging, In: Proceedings of the 28th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'22), IEEE (2022) pp. 1-4. type of document: Part of book/Proceedings Paper language: English URL |
2021
from data base, 2023. X. 02. |
János Hegedüs, Gusztáv Hantos, Péter Gábor Szabó, András Poppe: Rapid Failure Analysis of Installed LED Luminaire Through Standardized Processes, In: Vadim, Tsoi; Lorenzo, Codecasa; Bernhard, Wunderle (szerk.) Proceedings of the 27th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'21 online), IEEE (2021) pp. 112-117. type of document: Part of book/Proceedings Paper language: English URL |
2020
from data base, 2023. X. 02. |
Bognár György, Takács Gábor, Szabó Péter G., Rózsás Gábor, Pohl László, Plesz Balázs: Integrated Thermal Management in System-on-Package Devices, PERIODICA POLYTECHNICA-ELECTRICAL ENGINEERING AND COMPUTER SCIENCE 64: (2) pp. 200-210. type of document: Journal paper/Article language: English URL |
2020
from data base, 2023. X. 02. |
Rózsás Gábor, Bognár György, Takács Gábor, Szabó Péter Gábor, Plesz Balázs: Process and Measurement of Electroplated Back-Contact Integrated Microchannel Cooling Devices for CPV Cells, In: IEEE, , (szerk.) Proceedings of the 26th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC), IEEE (2020) 9420517 type of document: Part of book/Proceedings Paper language: English URL |
2016
from data base, 2023. X. 02. |
G. Takács, P. G. Szabó, Gy. Bognár: Enhanced thermal characterization method of microscale heatsink structures, MICROELECTRONICS RELIABILITY 67: pp. 21-28. type of document: Journal paper/Article number of independent citations: 7 language: English URL |
2015
from data base, 2023. X. 02. |
Dirk Schweitzer, Ferenc Ender, Gusztáv Hantos, Péter G. Szabó: Thermal transient characterization of semiconductor devices with multiple heat sources—Fundamentals for a new thermal standard, MICROELECTRONICS JOURNAL 46: (2) pp. 174-182. type of document: Journal paper/Article number of independent citations: 36 language: English URL |
2015
from data base, 2023. X. 02. |
G. Takács, P. G. Szabó, Gy. Bognár: Thermal management in System-on-Package structures by applying microscale heat sink. Part I: Consideration of the appropriate channel length of microscale heat sink(s), MICROELECTRONICS JOURNAL 46: (12 A) pp. 1202-1207. type of document: Journal paper/Article number of independent citations: 6 language: English URL |
2011
from data base, 2023. X. 02. |
Péter G. Szabó, Vladimír Székely: Investigation of parallel heat flow path in electro-thermal microsystems, MICROSYSTEM TECHNOLOGIES 17: (4) pp. 533-541. type of document: Journal paper/Article language: English URL |
2009
from data base, 2023. X. 02. |
Péter Gábor Szabó, Vladimír Székely: Characterization and modeling of electro-thermal MEMS structures, MICROSYSTEM TECHNOLOGIES 15: (8) pp. 1293-1301. type of document: Journal paper/Article number of independent citations: 6 language: English URL |
| Number of independent citations to these publications: | 55 |
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