Olivér Krammer - ODT Personal data sheet


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Personal data sheet

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personal data approved: 2024. I. 24.

Personal data

name	Olivér Krammer
name of institution	Budapest University of Technology and Economics
doctoral school	BME Doctoral School of Electrical Engineering (Announcer of research topic Az adott oktató valamelyik doktori iskolában kiírt doktoranduszok számára kutatási témát, amire most jelentkezni is lehet, de még nincsen témavezetett doktorandusza. )
the share of work in the different doctoral schools.	BME Doctoral School of Electrical Engineering 100%

Contact details
E-mail address	krammerett.bme.hu
phone number	+36 1 463-2755
	own web page

Academic title
scientific degree, title	Ph.D.
year degree was obtained	2010
discipline to which degree belongs	electrical engineering
institution granting the degree	Budapest University of Technology and Economics

Employment
2008 -	Budapest University of Technology and Economics university professor or researcher

Thesis topic supervisor

number of doctoral students supervised until now

number of students who fulfilled course requirements

students who obtained their degrees:

Tareq Al-Ma'aiteh

PhD

2022

DSEE

completed course requirement:

Tamás Garami

(PhD)

2016/08

DSEE

Thesis topic proposals

Research
research area	Physical properties of solder materials, soldering technologies, reliability of solder joints
research field in which current research is conducted	electrical engineering material sciences

Publications

2021

Illés Balázs, Hurtony Tamás, Medgyes Bálint, Krammer Olivér, Dusek Karel, Busek David: Sn and Bi whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 ultra-thin film layers, VACUUM 187: 110121
type of document: Journal paper/Article
number of independent citations: 5
language: English
URL

2021

Skwarek Agata, Krammer Olivér, Hurtony Tamás, Ptak Przemysław, Górecki Krzysztof, Wroński Sebastian, Straubinger Dániel, Witek Krzysztof, Illés Balázs: Application of ZnO Nanoparticles in Sn99Ag0.3 Cu0.7-Based Composite Solder Alloys, NANOMATERIALS 11: (6) 1545
type of document: Journal paper/Article
number of independent citations: 8
language: English
URL

2020

Veselý P., Bušek D., Krammer O., Dušek K.: Analysis of no-clean flux spatter during the soldering process, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY 275: 116289
type of document: Journal paper/Article
number of independent citations: 9
language: English
URL

2019

Krammer Oliver, Dušek Karel: Numerical investigation on the effect of the printing force and squeegee geometry on stencil printing, JOURNAL OF MANUFACTURING PROCESSES 45: pp. 188-193.
type of document: Journal paper/Article
number of independent citations: 4
language: English
URL

2019

Martinek Péter, Krammer Oliver: Analysing machine learning techniques for predicting the hole-filling in pin-in-paste technology, COMPUTERS AND INDUSTRIAL ENGINEERING 136: pp. 187-194.
type of document: Journal paper/Article
number of independent citations: 9
language: English
URL

2018

O Krammer, B Gyarmati, A Szilágyi, B Illés, D Bušek, K Dušek: The effect of solder paste particle size on the thixotropic behaviour during stencil printing, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY 262: pp. 571-576.
type of document: Journal paper/Article
number of independent citations: 12
language: English
URL

2018

K Dušek, D Bušek, M Plaček, A Géczy, O Krammer, B Illés: Influence of vapor phase soldering fluid Galden on wetting forces (tombstone effect), JOURNAL OF MATERIALS PROCESSING TECHNOLOGY 251: pp. 20-25.
type of document: Journal paper/Article
number of independent citations: 8
language: English
URL

2015

O Krammer, T Garami, B Horváth, T Hurtony, B Medgyes, L Jakab: Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders, JOURNAL OF ALLOYS AND COMPOUNDS 634: pp. 156-162.
type of document: Journal paper/Article
number of independent citations: 13
language: English
URL

2014

O Krammer: Comparing the Reliability and Intermetallic Layer of Solder Joints prepared with Infrared and Vapour Phase soldering, SOLDERING & SURFACE MOUNT TECHNOLOGY 26: (4) pp. 214-222.
type of document: Journal paper/Article
number of independent citations: 35
language: English
URL

2013

Benedek Cs, Krammer O, Janóczki M, Jakab L: Solder Paste Scooping Detection by Multilevel Visual Inspection of Printed Circuit Boards, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS 60: (6) pp. 2318-2331.
type of document: Journal paper/Article
number of independent citations: 39
language: English
URL

Number of independent citations to these publications:

142

Scientometric data

list of publications and citations

number of scientific publications that meet accreditation criteria:

136

number of scientific publications:

136

monographs and professional books:

monographs/books in which chapters/sections were contributed:

scientific publications published abroad that meet the accreditation criteria:

126

publications not in Hungarian, published in Hungary, meeting the accreditation criteria:

number of independent citations to scientific publications and creative works:

673